I-EMI Shielding Film isetyenziswa kakhulu kwi-FPC ebandakanya iiModyuli zeeselfowuni, iPC, izixhobo zonyango, iikhamera zedijithali, izixhobo zemoto, njl.
I-LKES-800
I-LKES-1000
I-LEKS-6000
(1) Iimpawu zokuqhuba kakuhle
(2) Ukuqhuba kakuhle kombane
(3) Iipropati ezilungileyo zokukhusela
(4) Ukumelana nobushushu obuhle
(5) Ilungele ukusingqongileyo (iHalogen isimahla, iyahlangabezana neemfuno zeRoHS Directives kunye neREACH, njl.njl.)
I-LKES -800
Into | Idatha yoVavanyo | Umgangatho wovavanyo okanye indlela yoVavanyo |
Ukutyeba (Ngaphambi kokuLamination,mm) | 16±10% | Umgangatho woShishino |
Ukutyeba (Emva kokuLamination,mm) | 13±10% | Umgangatho woShishino |
Ukuchasa umhlaba(Ipleyite zegolide,f1.0mm, 1.0cm,Owu) | JIS C5016 1994-7.1 | |
Amandla okukrazula ifilimu eyomeleziweyo (N/25mm) | Umgangatho woShishino | |
I-Soldering Reflow engena-Lead (MAX 265℃) | Akukho stratification; Akukho gwebu | I-JIS C6471 1995-9.3 |
Solder (288℃, 10s, 3 amaxesha) | Akukho stratification; Akukho gwebu | I-JIS C6471 1995-9.3 |
Iinkcazelo Ngeempawu zokuKhusela(dB) | >50 | GB/T 30142-2013 |
Ukunyangwa komphezulu(mOwu/□) | <350 | Indlela yesiGqeba emine |
I-Flame Retardant | VTM-0 | UL94 |
Umlinganiswa Wokuprinta | PASS | JIS K5600 |
Ukubengezela(60°, Gs) | <20 | GB9754-88 |
Ukumelana nemichiza(I-Acid, ialkali kunye ne-OSP) | PASS | I-JIS C6471 1995-9.2 |
Ukuncamathela kwi-Stiffener (N/cm) | >4 | IPC-TM-650 2.4.9 |
I-LKES-1000
Into | Idatha yoVavanyo | Umgangatho wovavanyo okanye indlela yoVavanyo |
Ukutyeba (Emva kokuLamination,mm) | 14-18 | Umgangatho woShishino |
Iinkcazelo Ngeempawu zokuKhusela(dB) | ≥50 | GB/T 30142-2013 |
Umphezulu we-Insulation | ≥200 | Umgangatho woShishino |
Ukuncamathela ngokukhawuleza (Ikhulu lovavanyo lweeseli) | Akukho seli iwayo | I-JIS C 6471 1995-8.1 |
Ukumelana nokuSula utywala | Amaxesha angama-50 akukho monakalo | Umgangatho woShishino |
Ukunyangwa kwemikrwelo | Amaxesha ama-5 akukho Ukuvuza kwesinyithi | Umgangatho woShishino |
Ukunganyangeki komhlaba, (ukutyalwa kwegolide,f1.0mm, 1.0cm,Owu) | ≤1.0 | JIS C5016 1994-7.1 |
I-Soldering Reflow engena-Lead (MAX 265℃) | Akukho stratification; Akukho gwebu | I-JIS C6471 1995-9.3 |
Solder (288℃, 10s, 3 amaxesha) | Akukho stratification; Akukho gwebu | I-JIS C6471 1995-9.3 |
Umlinganiswa Wokuprinta | PASS | JIS K5600 |
I-LKES-6000
Into | Idatha yoVavanyo | Umgangatho wovavanyo okanye indlela yoVavanyo |
Ukutyeba (Emva kokuLamination,mm) | 13±10% | Umgangatho woShishino |
Iinkcazelo Ngeempawu zokuKhusela(dB) | ≥50 | GB/T 30142-2013 |
Ukuchasana noMhlaba, (Igolide etyatyekwe,f1.0mm, 1.0cm,Owu) | ≤0.5 | JIS C5016 1994-7.1 |
Ukuchasana noMhlaba, (Igolide etyatyekwe,f1.0mm, 3.0cm,Owu) | 0.20 | JIS C5016 1994-7.1 |
Ukukhupha amandla (N/cm) | Umgangatho woShishino | |
Umphezulu we-Insulation(mOh) | ≥200 | Umgangatho woShishino |
Ukuncamathela ngokukhawuleza(Ikhulu lovavanyo lweeseli) | Akukho seli iwayo | I-JIS C 6471 1995-8.1 |
I-Soldering Reflow engena-Lead (MAX 265℃) | Akukho stratification; Akukho gwebu | I-JIS C6471 1995-9.3 |
Solder (288℃, 10s, 3 amaxesha) | Akukho stratification; Akukho gwebu | I-JIS C6471 1995-9.3 |
I-Flame Retardant | VTM-0 | UL94 |
Umlinganiswa Wokuprinta | PASS | JIS K5600 |
Indlela yokuLamination | Imeko yokunyibilika | Imeko yokuqina | |||
Ubushushu (℃) | Uxinzelelo(kg) | Ixesha (ama) | Ubushushu (℃) | Ixesha(umzuzu) | |
Ngokukhawuleza- Lamination | LKES800/6000:180±10LKES1000:175±5 | 100-120 | 80-120 | 160±10 | 30-60 |
Qaphela:Umthengi unokuhlengahlengisa itekhnoloji ngokusekwe kwimeko yokwenyani xa kusetyenzwa.
(1)Khulula umaleko wokhuseleko kuqala, kwaye emva koko ubophelele kwi-FPC, 80℃Itafile yokufudumeza ingasetyenziselwa ukudibanisa kwangaphambili.
(2)I-Laminate ngokuhambelana nenkqubo engentla, ikhuphe, kwaye emva koko ikhuphe ifilimu ephetheyo emva kokupholisa.
(3)Inkqubo yokuqinisa.
(1) Inkcazo esemgangathweni yemveliso: 250mm×100m.
(2) Emva kokususa umbane ongatshintshiyo, iimveliso zipakishwe kwiphepha lefoyile ye-aluminiyam kwaye ziphinde zibeke ukomisa kuyo.
(3) Ngaphandle ifakwe kwiibhokisi zephepha kwaye igxininiswe ukuqinisekisa ukhuseleko lweemveliso ngexesha lokuthutha nokuphatha, kwaye ugweme umonakalo.
(1) Imeko yoGcino eCetyisiweyo
Ubushushu: (0-10)℃; Ukufuma: ngaphantsi kwe-70%RH
(2) Ingqalelo
(2.1) Nceda ungavuli ipakethe yangaphandle kwaye ulinganise ifilimu ekhuselayo kwindawo yokushisa kweeyure ze-6 ngaphambi kokusebenzisa ukunciphisa umphumo weqabaka kunye nombethe kwifilimu ekhuselayo.
(2.2) Cebisa ukuba isetyenziswe ngokukhawuleza emva kokuthatha kwindawo yokugcina ebandayo, kwimeko yokutshintsha komgangatho phantsi kobushushu obuqhelekileyo ixesha elide.
(2.3) Le mveliso ayichasananga ne-arhente yokutywinwa kwesigaba samanzi kunye ne-flux, ukuba ineteknoloji yokucubungula engentla, nceda uvavanye kwaye uqinisekise kuqala.
(2.4) Phakamisa ukukhawuleza kwe-lamination, i-vacuum laminating kufuneka ivavanywe kwaye iqinisekiswe.
(2.5) Ixesha lesiqinisekiso somgangatho phantsi kwale meko ingasentla ziinyanga ezi-6.