2021 China Uyilo olutsha lwe-Electronics i-Emi Rfi Shielding Tape - i-EMI Shielding Film enoKhuseleko oluLungileyo-Ithamsanqa lokusungula
2021 China Uyilo olutsha lwe-Electronics i-Emi Rfi Shielding Tape - i-EMI Shielding Film enoKhuseleko oluLungileyo-Ithamsanqa lokusungula
2021 China Uyilo olutsha lwe-Electronics i-Emi Rfi Shielding Tape - i-EMI Shielding Film enoKhuselo oluLungileyo-iNgcaciso yeThamsanqa:
Ingcaciso yeMveliso
I-EMI Shielding Film isetyenziswa kakhulu kwi-FPC ebandakanya iiModyuli zeeselfowuni, iPC, izixhobo zonyango, iikhamera zedijithali, izixhobo zemoto, njl.
Ukufumaneka kweMveliso
I-LKES-800
I-LKES-1000
I-LEKS-6000
Iimpawu zeMveliso
(1) Iimpawu zokuqhuba kakuhle
(2) Ukuqhuba kakuhle kombane
(3) Iipropati ezilungileyo zokukhusela
(4) Ukumelana nobushushu obuhle
(5) Ilungele ukusingqongileyo (iHalogen isimahla, iyahlangabezana neemfuno zeRoHS Directives kunye neREACH, njl.njl.)
Ulwakhiwo lweMveliso
Iimpawu zeMveliso
I-LKES -800
| Into | Idatha yoVavanyo | Umgangatho wovavanyo okanye indlela yoVavanyo |
| Ukutyeba (Ngaphambi kokuLamination, μm) | 16±10% | Umgangatho woShishino |
| Ukutyeba (Emva kokuLamination, μm) | 13±10% | Umgangatho woShishino |
| Ukuchasana noMhlaba(iGold plated, φ 1.0mm, 1.0cm, Ω) | JIS C5016 1994-7.1 | |
| Amandla okukrazula ifilimu eyomeleziweyo (N/25mm) | Umgangatho woShishino | |
| I-Soldering Reflow engena-Lead (MAX 265℃) | Akukho stratification; Akukho gwebu | I-JIS C6471 1995-9.3 |
| Solder (288℃, 10s, 3 amaxesha) | Akukho stratification; Akukho gwebu | I-JIS C6471 1995-9.3 |
| Iinkcazelo Ngeempawu zokuKhusela(dB) | >50 | GB/T 30142-2013 |
| Ukunyangwa koMphezulu (mΩ/ □) | ＜350 | Indlela yesiGqeba emine |
| I-Flame Retardant | VTM-0 | UL94 |
| Umlinganiswa Wokuprinta | PASS | JIS K5600 |
| Ukubengezela(60°, Gs) | ＜20 | GB9754-88 |
| Ukumelana nemichiza (Acid, alkali kunye ne-OSP) | PASS | I-JIS C6471 1995-9.2 |
| Ukuncamathela kwi-Stiffener (N/cm) | ＞4 | IPC-TM-650 2.4.9 |
I-LKES-1000
| Into | Idatha yoVavanyo | Umgangatho wovavanyo okanye indlela yoVavanyo |
| Ukutyeba (Emva kokuLamination, μm) | 14-18 | Umgangatho woShishino |
| Iinkcazelo Ngeempawu zokuKhusela(dB) | ≥50 | GB/T 30142-2013 |
| Umphezulu we-Insulation | ≥200 | Umgangatho woShishino |
| Ukuncamathela ngokukhawuleza (Ikhulu lovavanyo lweeseli) | Akukho seli iwayo | I-JIS C 6471 1995-8.1 |
| Ukumelana nokuSula utywala | Amaxesha angama-50 akukho monakalo | Umgangatho woShishino |
| Ukunyangwa kwemikrwelo | Amaxesha ama-5 akukho Ukuvuza kwesinyithi | Umgangatho woShishino |
| Ukuxhathisa eMhlabeni, (iGold plating, φ 1.0mm, 1.0cm, Ω) | ≤1.0 | JIS C5016 1994-7.1 |
| I-Soldering Reflow engena-Lead (MAX 265℃) | Akukho stratification; Akukho gwebu | I-JIS C6471 1995-9.3 |
| Solder (288℃, 10s, 3 amaxesha) | Akukho stratification; Akukho gwebu | I-JIS C6471 1995-9.3 |
| Umlinganiswa Wokuprinta | PASS | JIS K5600 |
I-LKES-6000
| Into | Idatha yoVavanyo | Umgangatho wovavanyo okanye indlela yoVavanyo |
| Ukutyeba (Emva kokuLamination, μm) | 13±10% | Umgangatho woShishino |
| Iinkcazelo Ngeempawu zokuKhusela(dB) | ≥50 | GB/T 30142-2013 |
| Ukumelana noMhlaba, (iGold plated, φ 1.0mm, 1.0cm, Ω) | ≤0.5 | JIS C5016 1994-7.1 |
| Ukumelana noMhlaba, (iGold plated, φ 1.0mm, 3.0cm, Ω) | 0.20 | JIS C5016 1994-7.1 |
| Ukukhupha amandla (N/cm) | Umgangatho woShishino | |
| Ukugqunywa komphezulu (mΩ) | ≥200 | Umgangatho woShishino |
| Ukuncamathela ngokukhawuleza(Ikhulu lovavanyo lweeseli) | Akukho seli iwayo | I-JIS C 6471 1995-8.1 |
| I-Soldering Reflow engena-Lead (MAX 265℃) | Akukho stratification; Akukho gwebu | I-JIS C6471 1995-9.3 |
| Solder (288℃, 10s, 3 amaxesha) | Akukho stratification; Akukho gwebu | I-JIS C6471 1995-9.3 |
| I-Flame Retardant | VTM-0 | UL94 |
| Umlinganiswa Wokuprinta | PASS | JIS K5600 |
Imeko eCetyisiweyo yokuLungiselela
| Indlela yokuLamination | Imeko yokunyibilika | Imeko yokuqina | |||
| Ubushushu (℃) | Uxinzelelo(kg) | Ixesha (ama) | Ubushushu (℃) | Ixesha(umzuzu) | |
| Ngokukhawuleza- Lamination | LKES800/6000:180±10LKES1000:175±5 | 100-120 | 80-120 | 160±10 | 30-60 |
Qaphela:Umthengi unokuhlengahlengisa itekhnoloji ngokusekwe kwimeko yokwenyani xa elungiswa.
(1) Khulula umaleko wokhuseleko kuqala, kwaye emva koko ubophe kwi-FPC, i-80℃ itafile yokufudumeza ingasetyenziselwa ukudityaniswa kwangaphambili.
(2) Laminate ngokuhambelana nenkqubo engentla, khupha, kwaye emva koko ukhuphe ifilimu ephetheyo emva kokupholisa.
(3) Inkqubo yokuqinisa.
Ukupakisha
(1) Ukucaciswa okusemgangathweni kwemveliso: 250mm×100m.
(2) Emva kokususa umbane ongatshintshiyo, iimveliso zipakishwe kwiphepha lefoyile ye-aluminium kwaye zikwafaka nesomiso kuyo.
(3) Ngaphandle ifakwe kwiibhokisi zephepha kwaye igxininiswe ukuqinisekisa ukhuseleko lweemveliso ngexesha lokuthutha kunye nokuphatha, kwaye ugweme umonakalo.
Ukugcinwa kunye neNgqwalasela
(1) Imeko yoGcino eCetyisiweyo
Ubushushu: (0-10)℃; Ukufuma: ngaphantsi kwe-70%RH
(2) Ingqalelo
(2.1) Nceda ungavuli ipakethe yangaphandle kwaye ulinganise ifilimu ekhuselayo kwindawo yokushisa kweeyure ze-6 ngaphambi kokusebenzisa ukunciphisa umphumo weqabaka kunye nombethe kwifilimu ekhuselayo.
(2.2) Cebisa ukuba isetyenziswe ngokukhawuleza emva kokuthatha kwindawo yokugcina ebandayo, kwimeko yokutshintsha komgangatho phantsi kobushushu obuqhelekileyo ixesha elide.
(2.3) Le mveliso ayichasananga ne-arhente yokutywinwa kwesigaba samanzi kunye ne-flux, ukuba ineteknoloji yokucubungula engentla, nceda uvavanye kwaye uqinisekise kuqala.
(2.4) Phakamisa i-lamination ekhawulezayo, i-vacuum laminating kufuneka ivavanywe kwaye iqinisekiswe.
(2.5) Ixesha lesiqinisekiso somgangatho phantsi kwale meko ingasentla ziinyanga ezi-6.
Imifanekiso yeenkcukacha zemveliso:
IsiKhokelo seMveliso esiNxulumeneyo:
Ishishini lethu libeka ugxininiso kulawulo, ukwaziswa kwabasebenzi abanetalente, kunye nolwakhiwo lolwakhiwo lweqela, ukuzama ngamandla ukonyusa umgangatho kunye nokuqonda uxanduva lwabathengi abangabasebenzi. Inkampani yethu iphumelele iSiqinisekiso se-IS9001 kunye neSatifikethi se-CE saseYurophu sika-2021 eTshayina yoYilo olutsha lwe-Electronics Emi Rfi Shielding Tape - EMI Shielding Film ene-Good Shielding - Lucky Innovative, Imveliso iya kubonelela kwihlabathi liphela, njenge: Estonia , Curacao , Turkmenistan ukuza kukundwendwela ngokufudumeleyo. Sinethemba lokuseka ubuhlobo bexesha elide olusekwe ekulinganeni nasekuzuzeni ngokufanayo. Ukuba ufuna ukudibana nathi, nceda ungalibazisi ukufowunela. Siya kuba lolona khetho lwakho.
NguRoberta ovela eMiami - 2017.02.28 14:19 Umphathi we-akhawunti wenze isingeniso esicacileyo malunga nemveliso, ukuze sibe nokuqonda okubanzi kwemveliso, kwaye ekugqibeleni sagqiba ekubeni sisebenzisane.
NguMegan waseNepal - 2018.09.23 18:44 -
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